As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan’s IC backend service firms including ASE Technology Holding, ChipMos Technologies and Chipbond Technology are moving to win more orders for packaging such chips with COP process or upgraded collimator packaging process, according to industry sources.
Makers of traditional optical fingerprint ID chips have usually contracted OCA (optically clear adhesive) process to modules assemblers, but this will no longer be the case with ultra-slim optical fingerprint sensor chips, which will be increasingly needed for 5G smartphones to allow more space for battery capacity expansion and will therefor require the support of more-advanced packaging technology, the sources said.
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